|
| 1984 - |
VLSI Standards, Inc. founded by Rury Ervin, Josef Berger
and Bob Montverde |
| 1985 - |
Surface Contamination Standards, Absolute Contamination
Standards |
| 1986 - |
Step Height Standards, Sheet Resistance Standards, Equipment
Qualification Service, Clean Room Sentry |
| 1987 - |
Film Thickness Standards, Resistivity Standards, Surface
Roughness Standards |
| 1988 - |
Line Width Standards |
| 1989 - |
Custom Deposition Service, Overlay Standards |
| 1990 - |
Custom Film Thickness Measurement Service, Monodisperse
Contamination Standards |
| 1991 - |
250 Angstrom Film Thickness Standards, Thin Film References
and Sets, Surface Topography Standards |
| 1992 - |
75 Angstrom Thin Film Reference, Below 0.2 micron Absolute
Contamination Standards, Particle Deposition Systems, Profiling Standards
Sets, 80 Angstrom Step Height Standard |
| 1993 - |
Film Thickness Measurement Service by Spectroscopic Ellipsometry |
| 1994 - |
200 mm Film Thickness Standards, Particle Deposition System
Support Kits |
| 1995 - |
Reticle Contamination Standards, Silicon Sheet Resistance
Standards, STS2, a Surface Topography Standards with a minimum lateral
pitch of 1.8 µm |
| 1996 - |
ISO 9001 Certified |
| 1997 - |
Nitride Film Thickness Standards, 4.5 nm and 7.5 nm Thin
Film Thickness Standards |
| 1998 - |
200 mm Resistivity Standards, PDS-80 |
| 1999 - |
15 Years of Excellence |
| 2000 - |
Calibration Curves, 300 mm Absolute Contamination Standards |
| 2001 - |
Aluminum Film Thickness and Resistivity Standards, AutoLoad Step Height Standards |
| 2002 - |
200 mm NanoLattice Standards |
| 2003 - |
300 mm X,Y NanoLattice Standards |
2004 - |
20 Years of Excellence, 20 nm Film Thickness Standards |
