20 Years of Product Introductions at VLSI Standards 1984 - VLSI Standards, Inc. founded by Rury Ervin, Josef Berger and Bob Monteverde   1985 - Surface Contamination Standards, Absolute Contamination Standards   1986 - Step Height Standards, Sheet Resistance Standards, Equipment Qualification Service, Clean Room Sentry   1987 - Film Thickness Standards, Resistivity Standards, Surface Roughness Standards   1988 - Line Width Standards   1989 - Custom Deposition Service, Overlay Standards   1990 - Custom Film Thickness Measurement Service, Monodisperse Contamination Standards   1991 - 250 Angstrom Film Thickness Standards, Thin Film References and Sets, Surface Topography Standards   1992 - 75 Angstrom Thin Film Reference, Below 0.2 micron Absolute Contamination Standards, Particle Deposition Systems, Profiling Standards Sets, 80 Angstrom Step Height Standard   1993 - Film Thickness Measurement Service by Spectroscopic Ellipsometry   1994 - 200 mm Film Thickness Standards, Particle Deposition System Support Kits   1995 - Reticle Contamination Standards, Silicon Sheet Resistance Standards, STS2, a Surface Topography Standards with a minimum lateral pitch of 1.8 µm   1996 - ISO 9001-1994 Certified   1997 - Nitride Film Thickness Standards, 4.5 nm and 7.5 nm Thin Film Thickness Standards   1998 - 200 mm Resistivity Standards, PDS-80   1999 - 15 Years of Excellence   2000 - Calibration Curves, 300 mm Absolute Contamination Standards   2001 - ISO 9001-2000 Certified, Aluminum Resistivity Standards, AutoLoad Step Height Standards   2002 - 200 mm NanoLattice Standards   2003 - 300 mm X,Y NanoLattice Standards   2004 - 20 Years of Excellence, 20 nm Film Thickness Standards   2005 - NanoCD standards   2006 - ITO sheet resistance standards for the flat panel display industry, NanoLattice and NanoCD for the mask industry.   2007 - 300 mm Resistivity Standards   2008 - Solar Reference Cells, Silica Contamination Standards, Edge Contamination Standards