20 Years of Product Introductions at VLSI Standards

1984 - VLSI Standards, Inc. founded by Rury Ervin, Josef Berger and Bob Monteverde
 
1985 - Surface Contamination Standards, Absolute Contamination Standards
 
1986 - Step Height Standards, Sheet Resistance Standards, Equipment Qualification Service, Clean Room Sentry
 
1987 - Film Thickness Standards, Resistivity Standards, Surface Roughness Standards
 
1988 - Line Width Standards
 
1989 - Custom Deposition Service, Overlay Standards
 
1990 - Custom Film Thickness Measurement Service, Monodisperse Contamination Standards
 
1991 - 250 Angstrom Film Thickness Standards, Thin Film References and Sets, Surface Topography Standards
 
1992 - 75 Angstrom Thin Film Reference, Below 0.2 micron Absolute Contamination Standards, Particle Deposition Systems, Profiling Standards Sets, 80 Angstrom Step Height Standard
 
1993 - Film Thickness Measurement Service by Spectroscopic Ellipsometry
 
1994 - 200 mm Film Thickness Standards, Particle Deposition System Support Kits
 
1995 - Reticle Contamination Standards, Silicon Sheet Resistance Standards, STS2, a Surface Topography Standards with a minimum lateral pitch of 1.8 µm
 
1996 - ISO 9001-1994 Certified
 
1997 - Nitride Film Thickness Standards, 4.5 nm and 7.5 nm Thin Film Thickness Standards
 
1998 - 200 mm Resistivity Standards, PDS-80
 
1999 - 15 Years of Excellence
 
2000 - Calibration Curves, 300 mm Absolute Contamination Standards
 
2001 - ISO 9001-2000 Certified, Aluminum Resistivity Standards, AutoLoad Step Height Standards
 
2002 - 200 mm NanoLattice Standards
 
2003 - 300 mm X,Y NanoLattice Standards
 
2004 - 20 Years of Excellence, 20 nm Film Thickness Standards
 
2005 - NanoCD standards
 
2006 - ITO sheet resistance standards for the flat panel display industry, NanoLattice and NanoCD for the mask industry.
 
2007 - 300 mm Resistivity Standards
 
2008 - Solar Reference Cells, Silica Contamination Standards, Edge Contamination Standards

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